Assembly and Integration

The activities involve mechanically integrating hardware and functionally integrating hardware or software to create a higher-level functional structure. Equipment Level, Subsystem Level, and System Level Assembly Integration activities are carried out by our personnel within the infrastructure of our institute.”
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Assembly Integration Detail Information

Equipment Level Assembly Activities

  • Ultrosonic Washing
  • Marking
  • Mechanical Assembly
  • Mechanical Disassembly
  • Manual Assembly and Soldering
  • Torqueing
  • Chemical Application and Curing
  • Mechanical Reprocessing
  • Mechanical Inspection
  • Manual Assembly Heater Process
  • Dc-Dc Assembly
  • Filter Assembly, Bonding, Curing and Soldering
  • Heater Installation
  • Lubrication
  • Thermal Interface Preparation and Application
  • Source
  • Alignment
  • Optical Alignment
  • Opto Mechanical Assembly
  • Bearing Hub Assembly
  • Balance
  • Wire Winding
  • Functional Test

System Level Integration Activities

Mechanical Assembly Activities

  • Use of Mechanical Ground Support Equipment
  • Preliminary preparations for assembly of structural parts and equipment
  • Structural Part Assemblies
  • Thermal Hardware Assemblies
  • Cabling Laying
  • Test Instrumentation Assembly and Disassembly
  • Equipment Assemblies
  • Grounding
  • Alignment
  • Mechanical Reprocessing
Integration Activities

  • YEDE installation and use
  • Connection (continiuty) Tests
  • Dielectric Withstand Tests
  • Insulation Resistance Tests
  • RF/Microwave Loss Tests
  • Bonding Resistance Tests
  • Grounding Measurements
  • Connector Assemblies
  • Equipment Interface Tests,
  • Thermal Hardware Lines Tests,
  • Test Instrumentation Tests

Functional Test Activities

  • Functional Tests
  • Performance Tests
  • Mission Tests
  • Polarity Test
  • Launcher Interface Tests

Integration Infrastructure
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