UZAY
Inspection Facility
The Test and Inspection Infrastructures established within TÜBİTAK Space Technologies Research Institute are used to qualify all design and workmanship activities from board level to system level, as well as component level controls. After qualification, the equipment and satellite system are verified to be ready for flight.
Thermal Camera Reviews
Thermal camera images helps to inspect PCBs by detecting the defective component via monitoring the thermal values of the components on the PCB after environmental tests.
Micro-Section Inspection
It is a destructive inspection method that allows detailed visual inspection of internal structural defect occurrences and dimentional measurement of the micro-section of the defective region from mounted or empty PCB.
X-Ray Inspections
X-ray imaging technique is used to examine the internal metallic structures of the circuit elements and the PCB solder connection structures made with the reflow technique.
Using the X-ray technique allows:
- BGA solder connection evaluations
- Control of Metallic Lines,
- Chip wire connection confirmation,
- Evaluation of through hole and solder fill checks by non-destructive testing.
Visual Inspection
The compatibility of the printed circuit boards and solder connections is evaluated with the Stereo Microscope (1-2). It provides:
- Empty RAC evaluations (3)
- Evaluation of solder joints (4-5)
- Micro-section evaluations (6)
- Monitoring of error analysis processes with stereo microscope
