Thermal camera images helps to inspect PCBs by detecting the defective component via monitoring the thermal values of the components on the PCB after environmental tests.
X-ray imaging technique is used to examine the internal metallic structures of the circuit elements and the PCB solder connection structures made with the reflow technique.
Using the X-ray technique allows:
Stereo Microscope (1-2) is used to evaluate the suitability of printed circuit boards and solder joints. In this context;
