UZAY
Inspection Infrastructure
The Test and Inspection Infrastructures established within TÜBİTAK Space Technologies Research Institute are used to qualify all design and workmanship activities from board level to system level, as well as component level controls. After qualification, the equipment and satellite system are verified to be ready for flight.
Thermal Camera Reviews
After the environmental test, the thermal values of the components on the BDK are monitored to detect defective components and evaluate the BDK.
Micro Section Examination
It is a destructive inspection method that allows the area to be evaluated by taking a micro-section of the area in order to make detailed visual examinations and dimensional measurements of empty or component assembled BDK internal structural defect formations.
X-Ray Inspections
X-ray imaging is used to examine the internal metallic structures of the circuit elements and the BDK solder joint structures made by the reflow technique.
using the X-ray technique;
- BGA solder joint evaluations,
- Control of Metallic Lines,
- Wafer connection confirmation,
- Through-hole and solder fill checks are evaluated by non-destructive testing.
Visual Inspection
Stereo Microscope (1-2) is used to evaluate the suitability of printed circuit boards and solder joints. In this context;
- Evaluations of empty BDK (3),
- Evaluations of solder connections (4-5),
- Micro-section evaluations (6)
- Error analysis processes are monitored with a stereo microscope.
