UZAY
Assembly and Integration
These are the activities of mechanically combining hardware and creating a higher level functional structure by functionally combining hardware or software. Equipment Level, Subsystem Level and System Level Assembly Integration activities are carried out by our personnel in the infrastructure of our Institute.
Assembly Integration Detail Information
Equipment Level Assembly Activities
- Ultrosonic Washing
- Marking
- Mechanical Assembly
- Mechanical Disassembly
- Manual Assembly and Soldering
- Torqueing
- Chemical Application and Curing
- Mechanical Reprocessing
- Mechanical Inspection
- Manual Assembly Heater Process
- Dc-Dc Assembly
- Filter Assembly, Bonding, Curing and Soldering
- Heater Installation
- Lubrication
- Thermal Interface Preparation and Application
- Source
- Alignment
- Optical Alignment
- Opto Mechanical Assembly
- Bearing Hub Assembly
- Balance
- Wire Winding
- Functional Test
System Level Integration Activities
Mechanical Assembly Activities
- Use of Mechanical Ground Support Equipment
- Preliminary preparations for assembly of structural parts and equipment
- Structural Part Assemblies
- Thermal Hardware Assemblies
- Cabling Laying
- Test Instrumentation Assembly and Disassembly
- Equipment Assemblies
- Grounding
- Alignment
- Mechanical Reprocessing
Integration Activities
- YEDE installation and use
- Connection (continiuty) Tests
- Dielectric Withstand Tests
- Insulation Resistance Tests
- RF/Microwave Loss Tests
- Bonding Resistance Tests
- Grounding Measurements
- Connector Assemblies
- Equipment Interface Tests,
- Thermal Hardware Lines Tests,
- Test Instrumentation Tests
Functional Test Activities
- Functional Tests
- Performance Tests
- Mission Tests
- Polarity Test
- Launcher Interface Tests
